§3.1 LED封装流程简介（国外英文资料）.docVIP

§3.1 LED封装流程简介（国外英文资料） In this paper, by suyd618 contribution Powerpoint documents may be a poor experience at the WAP end. It is recommended that you choose TXT, or download the source file to the native view. Chapter 3 the packaging process of LEDs packaging process Professor su coopers University of jinan college of science The 2011-2-14 University of jinan college of science one Chapter 3 the packaging process reference material for LED packaging process: reference material: Packaging technology, LED packaging technology packaging technology Zhao chao, director of the Shanghai jiaotong publishing house, Shanghai jiaotong press, 2010 The 2011-2-14 University of jinan college of science 2 Chapter 3 the packaging process of LEDs packaging process Are: the main function of packaging the main function of pieces pieces pieces have a physical protection of electrical connection standard normalization LED packaging technology are mostly based on the discrete semiconductor devices packaging technology Packaging technology are mostly based on the discrete semiconductor devices packaging technology Development are mostly in discrete semiconductor encapsulation technology and evolved, but there are a lot of particularity. Development and evolution come in, but they are very special. There are other discrete electronic components of electrical properties and luminescence properties of LED light-emitting device And light-emitting devices luminescence properties of p-n junction emit photons to the parties and the photon is likely to launch to the parties to the emission probability is the same Chapter 6 details the detailed analysis How do you raise the probability of a photon? How do you raise the probability of a photon? The 2011-2-14 University of jinan college of science 3 Chapter 3 encapsulation of LED packaging process packaging: encapsulation summary: Packaging, for example In conventional phi 5 mmled encapsulation, for example Conventional packaging will be 0.25 mm squ