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HYPERLINK /10.1016/j.microrel.2016.06.001 Microelectronics Reliability 63 (2016) 111–119 Contents lists available at HYPERLINK /science/journal/ ScienceDirect Microelectronics Reliability j o u r n a l h o m e p a g e : HYPERLINK /locate/mr w w w . e l s e v i e r . c o m / l o c a t e / m r Reliability analysis of 3D heterogeneous microsystem module by simplified finite element model通过简化有限元模型对3D异质微系统模块的可靠性分析 Meng-Kao Yeh, Chun-Lin Lu Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan R.O.C. a r t i c l e i n f o Article history: Received 27 January 2016 Received in revised form 12 May 2016 Accepted 1 June 2016 Available online 9 June 2016 Keywords: 3D heterogeneous module Reliability analysis Through-silicon via Microgyroscope Thermal cycling test关键词： 3D异质模块可靠性分析穿硅微通道 热循环试验  a b s t r a c t摘要 Analyzing the structural reliability of 3D heterogeneous microsystem modules is an important step in their devel-opment. 分析3D异质微系统模块的结构可靠性是其发展的重要一步。The finite element models of such modules are simplified by simulating the complicated structure of MEMS (microelectromechanical systems) devices integrated into a single interposer. 通过模拟集成到单个中介层中的MEMS（微机电系统）器件的复杂结构来简化这种模块的有限元模型。In this study, thermal stress and cycling analyses for different finite element models of 3D heterogeneous microsystem modules are investi-gated.在这项研究中，热应力和循环分析的不同有限元模型的3D异质微系统模块进行了投资。 The results of the thermal stress analysis reveal the values of the maximum von Mises stress in the finite element models, at the interface between the interposer and the microgyroscope, and in the microgyroscope spring.热应力分析的结果揭示了在有限元模型中，在内插器和微陀螺之间的界面处以及在微陀螺弹簧中的最大von Mises应力的值。 They also illustrate the advantages and disadvantages of the different fabrication models. 模块可靠性评估也通过热循环分析获得，其结果表明，设计用于减少计算时间的适当简化的模型有益于可靠性分析。Module reliabil-ity assessments are also obtained through a thermal cycling analysis, the results of which show that properly sim-plified models designed to red