文章——高速热仿真-HOTFLASH.PDF

ELECTRONICS HOT FLASH Using a reduced-order method, engineers at Fairchild Semiconductor have been able to decrease development time for electronic components for electric and hybrid electric vehicles. By employing ANSYS Icepak for thermal management and ANSYS Simplorer for multi-domain systems design, the engineers performed dynamic thermal analysis under realistic power loss conditions approximately 2,000 times faster than a full 3-D thermal analysis. By Roy Davis, Senior Manager, Ann Arbor, USA Klaus Neumaier, RD Engineer, Fairchild Semiconductor, Munich, Germany n electric vehicles (EVs) and hybrid electric vehicles (HEVs), industrial, cloud, automotive, lighting and computing indus- many of the systems we take for granted in internal com- tries. A typical Fairchild inverter consists of an array of six insu- I bustion automobiles must be implemented differently. In lated gate bipolar transistors (IGBTs), each of which is paired addition to the main powertrain motor–generator sets, some with an anti-parallel diode, to convert DC voltage provided by accessory systems are also electrified. For example, because the vehicle’s battery pack into three-phase AC voltage required the engines in these vehicles do not run continuously, electri- to drive the AC motors. Two IGBTs and two diodes form each cally driven air-conditioning (AC) compressors and transmis- “half-bridge” powering one phase of the motor. A single IGBT sion oil pumps may be used instead of usual engine accessory and diode pair form one bi-directional switch and, in combina- belt-driven systems. All of these electric drives require fast, tion with the other switches in the inverter, operate according efficient and reliable power electronic converters. to a pulse-width modulation