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SMT制程管控要点(国外英语资料)
SMT制程管控要点(国外英语资料)
1. solder paste control point
1-1 refrigerator temperature 0 ~ 10 degrees, thermometer calibration every six months.
1-2 solder paste according to flow number first in first out.
1-3, solder paste temperature 4hrs or more before you can use, beyond the 72hrs is not used, must be returned to the refrigerator. Use
Stir for 7 minutes.
1-4 turn on the solder paste and use it in 12hrs. 1-5 degrees solder paste storage period of 4 months.
1-6 temperature zone at any time to maintain four bottles of solder paste.
1-7 gloves must be provided.
1-8 solder paste control should have W/I
1-9, the mixer should have W/I, but need not check, but need to verify the time
2. MPM control point
2-1 must bring electrostatic gloves.
2-2 have the direction of S.O.P intake plate.
The program of 2-3 S.O.P is the same as the program on the machine.
2-41 hours, two pieces, measurement of tin thickness, tin thickness standard (steel thickness + 0.05) + 0.03.
2-5 steel plate life 20000 times, S/O must be registered at the end of use.
2-6 clean the steel plate every two hours and register.
2-7 steel tension 30~45N/cm.
2-8 day, week, month maintenance record, log on the machine.
2-9 prints are examined with 3 magnification lenses.
2-10 stick to S/N Label.
2-11 solder paste thickness gauge is adjusted once a year.
2-12 MPM and solder paste thickness gauge should have W/I.
3. CP rapid machine control point
3-1 grounding table must be equipped with electrostatic gloves and electrostatic ring.
3-2 S.O.P..
The program on 3-3 S.O.P. must be the same as the program on the material list and on the machine.
3-4 change parts to measure R.L.C. and record, R.L.C. check once every half a year.
R STD range 3 yards = 5%, 1 yards = 1%
C L has no body + 20%, others are specified on W/I.
3-5 day, week, month maintenance record, log on the machine.
3-6 Support Pin.
3-7, the machine should have W/I
4. GSM universal control point
4-1, grounding on the table, with electrostatic gloves and electrosta
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