SMT制程管控要点(国外英语资料).docVIP

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SMT制程管控要点(国外英语资料)

SMT制程管控要点(国外英语资料) 1. solder paste control point 1-1 refrigerator temperature 0 ~ 10 degrees, thermometer calibration every six months. 1-2 solder paste according to flow number first in first out. 1-3, solder paste temperature 4hrs or more before you can use, beyond the 72hrs is not used, must be returned to the refrigerator. Use Stir for 7 minutes. 1-4 turn on the solder paste and use it in 12hrs. 1-5 degrees solder paste storage period of 4 months. 1-6 temperature zone at any time to maintain four bottles of solder paste. 1-7 gloves must be provided. 1-8 solder paste control should have W/I 1-9, the mixer should have W/I, but need not check, but need to verify the time 2. MPM control point 2-1 must bring electrostatic gloves. 2-2 have the direction of S.O.P intake plate. The program of 2-3 S.O.P is the same as the program on the machine. 2-41 hours, two pieces, measurement of tin thickness, tin thickness standard (steel thickness + 0.05) + 0.03. 2-5 steel plate life 20000 times, S/O must be registered at the end of use. 2-6 clean the steel plate every two hours and register. 2-7 steel tension 30~45N/cm. 2-8 day, week, month maintenance record, log on the machine. 2-9 prints are examined with 3 magnification lenses. 2-10 stick to S/N Label. 2-11 solder paste thickness gauge is adjusted once a year. 2-12 MPM and solder paste thickness gauge should have W/I. 3. CP rapid machine control point 3-1 grounding table must be equipped with electrostatic gloves and electrostatic ring. 3-2 S.O.P.. The program on 3-3 S.O.P. must be the same as the program on the material list and on the machine. 3-4 change parts to measure R.L.C. and record, R.L.C. check once every half a year. R STD range 3 yards = 5%, 1 yards = 1% C L has no body + 20%, others are specified on W/I. 3-5 day, week, month maintenance record, log on the machine. 3-6 Support Pin. 3-7, the machine should have W/I 4. GSM universal control point 4-1, grounding on the table, with electrostatic gloves and electrosta

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