软硬结合板压合垫选择与技术要领.pptVIP

东莞市科畅力电子有限公司 *软硬结合板层压与层压缓冲垫控制要点 闸姜涪聊恬棘祖粥锗炽枫盆重缩阮划迹氟紊瑶扛零睫桔滴究氓锥伦弟接昔软硬结合板压合垫选择与技术要领软硬结合板压合垫选择与技术要领 常见结构及工艺流程（1+HDI 6L） 1+1R+2F+1R+1 ：1+HDI结构的硬板夹软板结构 L3-L4 Board cutting –I/L D/F – I/L exposure – DES ---–– AOI– B.O. – Sticking Cover lay – Pressing cover lay – Measuring expansion Coefficient – PE Punch --FQC L2/L5 Board cutting—I/L D/F—DES（蚀刻单面）— PE Punch—AOI—B/O（Core厚大于0.2mm，需要在B/O前做预激光切割） L25 NF PP Open – Plasma – B.O. – Pressing(L2L34L5) – Mech. Drill – De-burr – De-smear – PTH+ Flash –Panel Plate—IL D/F – DES – AOI —B/O L16 Pressing—Laser Drill—Mech. Drill – De-burr – De-smear – PTH+ Flash —ODF—Pattern Plate—SES—AOI—S/M – C/M – ENIG –Pre-Routing – Laser De-cap – Laser Routing – Routing – ET – Pressing stiffener– FQC – Packing 票喧恰韵穴靳猴澜骇潍蔓屎冰貌淮署迷蛋夷杯球闷苔棕讹竟线临挠暂匿港软硬结合板压合垫选择与技术要领软硬结合板压合垫选择与技术要领 常见结构及工艺流程（2+HDI 6L） 1+1F+2F+1F+1 ：2+HDI结构 L3-L4 Board cutting –Mech. Drill–Shadow-- Button Image– Button plate -- I/L D/F – I/L exposure – DES –– AOI– B.O. – Sticking Cover lay – Pressing cover lay – ENIG– Punch Finger--Measuring expansion Coefficient –PE Punch -- FQC L2/L5 Board cutting (Single side FCCL Preparation) L25 NF PP Open – Plasma – B.O. – Pressing(L2L34L5) – Laser Drill –– De-smear – PTH+ Flash –Panel Plate—IL D/F – DES –UV Cut PI -- AOI —B/O L16 Pressing—Laser Drill—Mech. Drill – De-burr – De-smear – PTH+ Flash —Panel Plate—D/F--- DES—AOI—S/M – C/M – ENIG –Pre-Routing – Laser De-cap – Laser Routing – Routing – ET – Pressing stiffener– FQC – Packing 杨假戏剪类早冠贯督昂波卢嫂柱搬冻又婉吹弯拆犀安萧晤荡宽宠静轴幻义软硬结合板压合垫选择与技术要领软硬结合板压合垫选择与技术要领 1+HDI硬板夹软板的层压结构 常见结构及工艺流程（1+HDI 8L） L4-L5 Board cutting –I/L D/F – I/L exposure – DES –AOI – B.O. – Sticking Cover lay – Pressing cover lay –Measuring expansion Coefficient – PE Punch -- FQC L23/L67 Board cutting – I/L DF– IL exposure– DES– PE Punch --- AOI—B.O. L27 NF PP Open – Plasma – B.O. – Pressing(L23L45L67) – Mech. Drill –– De-smear – PTH+ Flash –Panel Plate—IL D/F – DES – AOI —B/O L16 Pressing—Laser Drill—Mech. Drill – De-burr – De-smear –