Numericsimulationofth_省略_sionbondingforC.pdf

Vol. 11 . 6 Trans. Nonferrous Met. Soc. China Dec. 2001 [Article ID] 1003- 6326( 2001)06- 0908- 04 Numeric simulation of thickness of intermetallic compounds in interface zone of diffusion bonding for Cu and Al LI Ya-jiang() , WU Hui-qiang( ) , CHEN Mao-ai() , FEN Tao( ) ( Key Lab of Liquid Structure and Heredity of Materials, Ministry of Education, School of Materials Science and Engineering, Shandong University, Jinan 250061, P.R.China) [Abstract] Numeric model of intermetallic compound formation and growth in the vacuum diffusion bonding of copper and aluminum was established, and proved by EPMA and micro-hardness test etc. The numeric simulation of thickness of the intermetallic compound results in accord with the tests well. This study provides some references to determinewelding parameters in the vacuum diffusion bonding of Cu/ Al dissimilar materials. [Key words] vacuum diffusion bonding; intermetallic compounds; numeric simulation [CLC number] T 453.9 [Document code] A INTRODUCTION ing to electron concentration for Cu and Al (see Table 1) . Copper and aluminum are widely used in indus- Table Possible electronic compounds nearby try and their joining is an important part in the metal welding. Brazing method is also adverse for coppers interface of Cu/ Al vacuum diffusion bonding thermal conductivity rate is high, the expansion coef- Item Cu-Al intermetallic compounds