FLEX缺陷概要1.pptVIP

1 AB (Air bubble) 空汽泡 BH (Block hole) 堵孔 BVH (Broken via hole)小孔孔偏 BT (Broken tab)微连接点断开 BU (Burr) 毛刺 CNO (Cover lay no opening) 覆盖膜冲形不完全 GC (Gold crack) 金裂 IL (islands)铜屑/残铜 MK (Marker)记号笔印 OE (Over etch)过蚀 SMP(Solder mask peeling)油墨掉落 TR (Tearing)板撕裂 TS(Thinck solder)厚锡/聚锡 USM (Uneven solder mask)油墨不均 WR (Wrinkle)板面起皱 SC (Short circuit) 短路 OC (Open circuit)开路 PH (Pin hole) 针孔 NI (Nick) 缺口 PR (Projection)线边突出 SW (Solder wicking)锡渗透 GW (Gold wicking)金渗透 SOG (Solder on gold)金面有锡 EC (Expose copper) 露铜/锡面露铜 GP (Gold peeling)掉金 ECG (Expose copper on gold)金面露铜 CON (Contamination)板面脏物 EFM (Embedded