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- 约4.2千字
- 约 22页
- 2017-08-18 发布于浙江
- 举报
PCB工艺性要求的
EDA相关规范讲座
工艺性要求
Evaluation only.
Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.
Copyright 2004-2011 Aspose Pty Ltd.
EDA相关的规范
Evaluation only.
Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.
Copyright 2004-2011 Aspose Pty Ltd.
PCB厚度
推荐采用的PCB厚度:0.5 mm,0.7mm,0.8 mm,1 mm,1.5 mm,1.6 mm,(1.8 mm),2 mm,2.2mm,2.3mm,2.4 mm,(2.45mm),(2.8mm),(3.0mm),3.2 mm,4.0mm,(4.5mm),(5.0mm),(5.9mm),6.4 mm,(7.0mm)。
Evaluation only.
Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0.
Copyright 2004-2011 Aspose Pty Ltd.
PCB铜箔的选择
基铜厚度
设计的最小线宽/线间距(mil)
Oz/Ft2
公制(um)
2
70
8/8
1
3
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