晶圆代工Global and China Wafer Foundry Industry Report, 2010.pdfVIP

晶圆代工Global and China Wafer Foundry Industry Report, 2010.pdf

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晶圆代工Global and China Wafer Foundry Industry Report, 2010

Global and China Wafer Foundry Industry Report, 2010 The year of 2010 has been the best year for wafer foundry industry since 2000. It is expected that the output value of wafer foundry industry will reach USD27.6 billion, up 37.8% year-on-year. In addition, the output value of the entire semiconductor industry is projected to achieve USD274.5 billion, rising 21.5% year-on-year. Income of World’s 15 Wafer Foundries, 2007-2010E The wafer foundry industry witnessed a prosperous development in 2010, as a result of the economic recovery and the fab-lite strategy adopted by many large semiconductor companies. Most of the companies have continued to use existing fabs or produce analog products in their own fabs instead of investing in new fabs, while outsourcing the advanced digital CMOS process to wafer foundries because the RD of processes at 65-nm and below that requires a huge amount of capital and labor force is unaffordable even to large semiconductor companies. For example, TI announced to outsource the production of the products at 32-nm and below to TSMC. Renesas, Japan’s biggest semiconductor manufacturer, also announced to outsource the production of its future top-class products to TSMC in July 2010. Thus, the wafer foundry industry will see a higher average growth margin than that of the semiconductor industry in the future. In the meantime, the wafer foundry industry also substantially increased the capital expenditure to improve technology and capacity in 2010. The capital expenditure of TSMC, UMC and Global Foundries will be as high as USD5.9 billion, USD1.9 billion and around USD2.5 billion respectively in 2010, all tripling the figures in 2009. In 20

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