刀削面机Title.ppt

Greatest challenges of the 21st Century:;“Terascale electronics---endless quest for IC speed”;Information age?;Technology for Information age--------Microelectronics;Who are chip makers?;History Invention of solid state electronics (40’s) --------The transistors Then IC Then Mainframe (60’s)----execution and storage Then PC (70’s)----execution and storage Then PC plus internet plus WWW -----execution, storage, and transmission;Why so exciting?;“Turmoil and opportunities at the dawn of the 21st Century ---the road of an academic department in higher education” (Toh-Ming Lu, , 2000) ;Computer logic---a series of on and off operation (clicks);MOSFET Transistor ;Key questions in the industry;Some key technological challenges;Intel: 1 THz FET, 25nm channel length IBM: 210 GHz HBT, base 100 atoms ;metal;Limit on RC delay;Interconnect (RC) delay;“Terascale electronics---endless quest for IC speed”; --Shorter wires, higher density, more functionalility— Beyond Roadmap ;Opportunities for more Si mainstream technologies: ---Decades beyond the Roadmap Stacked chip assemblies (logic, memories, interposer for passives); Heterogeneous systems for sensors and MEMS; Hard IP core-based SOC designs (including mixed signal); High speed processors; LAN architectures (for wireless applications and/or for multiplexed interconnects). Gutmann et al (2001);Pictorial Representation of 3D Integration Conceptusing Wafer Bonding, ;Processing issues: bonding-alignment through wafer via etching barrier and metallization Reliability: thermo and mechanical stability electromigration heat extraction;Broad band interconnect technology ---high speed data transfer Replacing electrical connection by optics: Modulators/switches: electro-optic, optic-optic Optical waveguides Data compression (software) ;R. Kersting, G. Stasser, and K. Unterrainer, Terahertz phase modulator, Electr. Lett., 36, 1156 (2000) ;Optical switches: MEMS---mirror switches: D. Bishop et al, Physics Today O