第八章 UDM硅片切削液.docVIP

AKLC300 Series De-Glue Concentrate for Photovoltaic Wafers AKLC300系列光伏硅片去胶浓缩液 AKLC300-De-Glue is a biodegradable water based, non caustic and non acidic material AKLC300去胶浓缩液是一种可生物降解、水性、非碱性、非酸性物质 PV wafer De-glue or De-bonding after wafering process 用于切片之后进行脫膠或脫粘 DI /RO water: Detergent dilution ratio – 10:1 to 30:1 去离子水/反渗透水:洗涤剂溶液比例 - 10:1至30:1 Application Temperature 25°C - 70°C 使用温度：25°C - 70°C Excellent wetting, De-bonding and rinsing properties 极好的湿润、脫粘和冲洗功能 DI / RO water surface tension reducer 降低去离子水/反渗透水表面张力 中國經銷商： 深圳市鑫晨楓科技有限公司 實驗室及倉庫地址: 深圳市寶安區沙井鎮北方永發工業區 電話:0755-61176798 傳真:0755AKLC300 Detergent Concentrate for Photovoltaic Wafers AKLC300系列光伏硅片洗涤剂浓缩液 AKLC300-Detergent is a biodegradable water based, non caustic and non acidic material AKLC300洗涤剂浓缩液是一种可生物降解、水性、非碱性、非酸性物质 PV wafer Cleaning after wafering 用于切片之后对光伏硅片进行清洗 DI /RO water: Detergent dilution ratio - 10:1 to 50 :1 去离子水/反渗透水:洗涤剂溶液比例 - 10:1至50:1 Application temperature: 45°C - 70°C 使用温度：45°C - 70°C Excellent wetting, cleaning and rinsing properties 极好的湿润、清洁和冲洗功能 Water surface tension reducer 降低去离子水/反渗透水表面张力 Completely cleans out SiC (silicon carbide) dust and other contaminants on wafer surfaces 可以彻底清洁硅片表面的碳化硅(SiC)尘埃以及其他脏污 Cleans and eliminates Cu (Copper) and Fe (Iron) on PV wafer surfaces after wafering and De-gluing process. 在切片以及去胶工序之后彻底清除光伏硅片表面的铜和铁 Biodegradable, non-hazardous and hence easily disposable 可生物降解、无危害，可以很容易进行处置 Biochemical Oxygen Demand (BOD) 2.0 mg/L (BOD less than 2.0 mg/L) 生化需氧量(BOD) 2.0 mg/L (BOD小于2.0 mg/L) Chemical Oxygen Demand (COD) 10.0 mg/L (COD less than 10.0 mg/L) 化学需氧量(COD) 10.0 mg/L (COD小于10.0 mg/L) 中國經銷商： 深圳市鑫晨楓科技有限公司 實驗室及倉庫地址: 深圳市寶安區沙井鎮北方永發工業區 電話:0755-61176798 傳真:0755L200C Cutting Fluid Conc. for Silicon Ingot Bricking/Squaring / Cropping 用于硅锭切块/破方/修整的L200C浓缩切削液 Application: Diamond wire Band saw processes 用途：金刚石线锯和带锯流程 L200C lubricant Series is a biodegradable water based, non caustic material L200C系列润滑剂是