成型过程中的汉英姓名的控制.docVIP

进料检验? ? Incoming QC Inspection (IQC)??IQI? ? 磨片? ? Wafer Grind? ?Back Grind? ? 贴片? ? Wafer Mount? ?? ? 甩干? ? Spinning? ?? ?划片? ? Wafer Saw? ?? ?装片? ? Die Attach (D/A)? ?? ?焊丝??球焊，打金丝，打线，焊线??Wire Bond (W/B)? ?? ?倒装芯片? ? Flip Chip (FC)? ?? ?热压焊? ? Thermal Compression Bond (TCB)? ?? ?烘烤??烘箱??Baking??Curing? ? 全检??三号目检??3rd Optical Inspection (3rd Opt.)? ?? ?包封??塑封??Molding??Encapsulation? ? 冲塑??冲胶??Degate? ?? ?后固化? ? Post Mold Cure (PMC)? ?? ?切筋??冲筋,切中筋??Damcar Cut??Trim? ? 去飞边? ? Deflash? ?? ?打印? ? Marking? ?? ?激光打印? ? Laser marking? ?? ?油墨打印? ? Ink UV marking? ?? ?电镀? ? Plat