低银无铅焊料的应用要SAC105垣Mn焊点可靠性验证试验.PDF

上半月出版 Casting Forging Welding 金属铸锻焊技术 低银无铅焊料的应用要SAC105 Mn 焊点 可靠性验证试验 施纪红 渊健雄职业技术学院 电气工程学院袁 江苏 苏州 2 15400 冤 摘 要院随着近年银价的持续上涨袁低银无铅焊料成为市场关注的焦点遥本文从实际应用的角度分析了低银焊料中 含银量对焊料熔点尧浸润性尧焊点可靠性三个重要焊接特性的的影响和目前低银无铅焊料的研究方向遥并通过小批量生 产袁验证了SAC105 掺杂Mn 后的焊点可靠性与SAC305 相当遥 关键词院低Ag 无铅焊料曰SAC 105垣Mn 曰SAC305 曰焊点曰可靠性 中图分类号院TG425 文献标识码院A 文章编号院 Application of Low-Ag Lead-free Solder要Solder Jo int Reliability Verification Test of SAC105+Mn SHI Jihong 渊Electrical Enginee ring Institute , Chie n-Shiung Institute of Tec hnology, Suzhou 2 154 11, China冤 Abstract 院The price of silver has been continuously on the rise over the past few years, which makes low-silver lead-free solder the focus of the market. A practical perspective were presented to analyze: the impacts of silver content in low-Ag solder on the three important welding properties, i.e. solder melting point, wettability, and solder j oint reliability, and the current research topics on low-Ag lead-free solder. In small batch production, the solder j oint reliability of SAC 105 with Mn addition is comparable to that of SAC305. Key words 院low-Ag lead-free solder; SAC 105垣Mn; SAC305; solder j oint; reliability RoHS(Restriction of Hazardous Substances)2006 将导致熔点温度的升高遥那么在固定铜含量的基础上袁 7 月 1 日正式实施以来袁 目前中国电子制造业 Ag 的减少对焊料有何影响袁本文将从实际生产中考虑较 的无铅化比率已达到70% 以上袁传统SnPb 焊料已 多的焊料的熔点尧浸润性尧焊点可靠性三个方面来分析遥 被无毒害的无铅焊料逐步