汽车电子行业Press-Fit技术无焊接解决方案Automotive-Interplex.PDF

汽车电子行业Press-Fit技术 无焊接解决方案 Automotive Press-Fit Technology Solderless Solutions 连接器及堆栈应用 Connectors and Stacking Applications 传感器及控制模块 Molded Sensor Control Modules 马达及开关控制 Motor Flapper Controls 总线连接及保险盒 Bus Bar Interconnects Fuse Receptacles 轮胎压力监控 Tire Pressure Monitors 连接盒 Junction Boxes 引擎及变速器控制 提供全球性精密零部件生产和组装服务 Engine Transmission Controllers Global Solutions for Complex Parts and Assemblies Interplex Electronic (Hangzhou) Co., Ltd. І No.3 Ave.8 HEDA І Hangzhou, China І Tel: +86 571 8691 3333 І Fax: +86 571 8691 2222 /pressi t World Solutions in Precision Parts and Assemblies 怡得乐的Press-fit技术是一种无焊接连接Pin技术。它的设计及测试能够达到汽车电子的各项测试要求 125℃）测试。 （基于IEC,EIA和SAE等国际标准），其中包括振动，机械性能及热冲击（温度高达 Interplex’s Press-Fit, Solderless Interconnect Technology is designed and testedIn to meet standard automotive re requirements for vibration, mechanical thermal shock for temperatures up to 125° C, as dei ned by the IEC, E EIA and SAE. 这 这种技术允许组装端子与印刷电路板（PCB）电镀通孔进行连接，通过这种技术可以实现一种机械式电 导导导 导通与维护而无需使用焊接技术。This technology allows for the assembly of a terminal or electrical lead to