innovative final nanofinish for pcbs with the organic metal 用有机 .pdf

Innovative Final Nanofinish for PCBs with the Organic Metal 用有机金属技术对线路板进行最终表面处理的创新产品Nanofinish B. Wessling, M. Thun, C. Arribas-Sanchez, S. Gleeson, J. Posdorfer, M. Rischka, B. Zeysing, N. Arendt Ferdinand-Harten-Str. 7 D-22949 Ammersbek Germany Fax: +49-40-604106-52 Email: wessling@ormecon.de Abstract 摘要 For the first time, an only few nanometre thin layer has been deposited on copper pads of printed circuit boards which efficiently protects against oxidation and preserves its solderability. The nano layer has a thickness of only nominally 50 nm, containing the Organic Metal (conductive polymer) and a small amount of silver. With 90% (by volume), the Organic Metal is the major component of the deposited layer, Ag is present equivalent to a 4 nm thickness. This Organic Metal – Ag complex final finish outperforms any established surface finishes. 第一次，只有几纳米厚的薄层沉积在印刷线路板的铜 pad 上，并且可以有效地防止氧化并 保证其焊锡性。纳米层的厚度仅仅只有50nm，包含有机金属（电导聚合体）和少量的银。 大于90% （体积）的有机金属是沉积层的主要组成部分，约存在相当于4nm 厚的银。这个 有机金属-银络合物的表面处理比任何已有的表面处理都要优越。 1. Introduction 导言 An Organic Metal (OM) is a special advanced form of conductive polymers which has metallic properties although being an organic material; it is synthesized and dispersed in form of 10 nm small primary particles [1]. The strong effect of the Organic Metal in the prevention of Cu oxidation has been published many years ago [2]. It is in commercial use since almost 10 years especially in a process for finishing printed circuit boards, providing solderability after storage and thermal ageing. There, the Organic Metal is used as the Cu surface preparation “predip” prior to an immersion Sn deposition [3]. In the meantime this process is well established and widely used in the printed circuit board industry as one of the top quality alternative finishes which are required for the lead-free elect