LED封装普及知识(LED encapsulation of knowledge).docVIP

LED封装普及知识(LED encapsulation of knowledge).doc

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LED封装普及知识(LED encapsulation of knowledge)

LED封装普及知识(LED encapsulation of knowledge) LED encapsulation of knowledge This paper is contributed by cheng construction Introduction of LED products LED products Orders, record A, light-emitting diodes (leds) Introduction of LED light-emitting diodes (leds) the main process and material 2, LED the main process and material Company main product structure to introduce three, the main products of the company structure to introduce LED photoelectric parameters and the four major advantages briefly LED photoelectric parameters, LED LED advantages An introduction to LED The light-emitting Diode is commonly known as a light-emitting Diode or a light-emitting Diode, which contains visible and invisible Light. Belongs to the category of photoelectric semiconductor including P and N pole in the structure, is a kind of rely on light-emitting semiconductor PN junction optoelectronic devices, it is divided into Lamp series, Top series, piranhas series, SMD series, High Power (Power) series... It is. In terms of Lamp, it is by an electronic Lamp electronic raw materials, raw materials (chips, gold wire or aluminium wire, and electronic materials support, silver glue or insulated), packaging materials Packaging materials (epoxy resin, color agents, packaging materials, auxiliary materials (modulus) of the three materials. Spreading agent), auxiliary materials and auxiliary materials definition: LED is made of electronic materials, packaging materials, auxiliary materials connection of a luminous closed-circuit electronic components. The five main materials of LED and the five main materials and the five major process The five main materials of the silver glue gold line epoxy resin wire sealing rubber joint test solid crystal five process LED mainly luminescent electronic materials - wafers Composition of wafers: made of gold pad, P pole, N pole, PN junction, and back gold layer. The classification of the chip: 1.1 according to the composition: binary: such as GaAs (gallium arseni

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