党智敏-低温快速固化环氧导电胶的制备与性能.pdfVIP

28 　5 　　10 　2011 Acta Mater iae Comp ositae Sin ica Vol.28 No.5 October 2011 :1000-3851(2011)05-0034-07 1 *1, 2 张　博 , 党智敏 (1. , 100029; 2. , 100083) 　:　 E-51 , (PA), (KH550)。 (), 。、 、, , 。60 ℃4 。65%, 3. 6×10- 4 Ψ cm;17. 6 M Pa。 85 ℃、 (RH) 85% 1000 10%。 :　;;;; :　TB332　　　:　A Preparation and performance of epoxy resin conductive adhesive with fas-t curing feature at low temperature 1 *1,2 ZHANG Bo , DANG Z imin (1. S tate Key Lab of C emical Resources Engineering, Beijing University of C emical Tec nology, Beijing 100029, C ina; 2. Department of Polymer Science and Engineering, Sc ool of C emistry and Biological Engineering, University of Science Tec nology Beijing, Beijing 100083, C ina) Abstract:　A t ermoset type isotropic conductive ad esive (ICA)w as prepared by epoxy resin E-51 as t e matrix, nanosized and microsized copper pow der modified by silane coupling KH550 as t e conductive fillers, polyamide resin wit low molecular w eig t as t e curing agent, and some ot er additives. A new liquid curing agent, polyamide resin w it low molecular weig t, w as used w ic solved some difficult problem s during t e preparation of ICA, suc as limit of quantity of conductive fillers. T e effects of different factors suc as curing agent, silane coupling agent, reducer, and conductive filler on t e bonding performance and t e conductivity for conductiv