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§3.1 LED封装流程简介(Introduction to § 3.1 LED encapsulation process)
§3.1 LED封装流程简介(Introduction to § 3.1 LED encapsulation process)
This article is contributed by suyd618
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Chapter 3 the packaging process of LEDs packaging process
Professor su coopers
University of jinan university
The 2011-2-14
University of jinan university
one
Chapter 3 encapsulation of LED packaging process reference materials: reference materials:
Packaging technology, LED packaging technology packaging technology
Zhao chao, ji aihua of suzhou, Shanghai jiaotong publishing house, Shanghai jiaotong publishing house, 2010.9
The 2011-2-14
University of jinan university
2
Chapter 3 encapsulation process of LED packaging process
Are: the main function of packaging the main function of pieces pieces pieces have a physical protection of electrical connection standard normalization LED packaging technology are mostly based on the discrete semiconductor devices packaging technology Packaging technology are mostly based on the discrete semiconductor devices packaging technology Development are mostly in discrete semiconductor encapsulation technology and evolved, but there are a lot of particularity. Development and evolution come, but there is a great particularity. There are other discrete electronic components of electrical properties and luminescence properties of LED light-emitting device And light-emitting devices luminescence properties of p-n junction emit photons to the parties and the photon is likely to launch to the parties to the emission probability is the same
Chapter 6 details the detailed analysis
How to improve the ejection probability of the photon? How to improve the ejection probability of the photon?
The 2011-2-14
University of jinan university
3
Chapter 3 encapsulation of LED packaging process package introduction:
For example, routine phi 5mmLED encapsulation is used as an example to encapsul
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