Layout 板层的基本观念（Basic idea of Layout board layer）.docVIP

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Layout 板层的基本观念（Basic idea of Layout board layer）.doc

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Layout 板层的基本观念（Basic idea of Layout board layer）

Layout 板层的基本观念（Basic idea of Layout board layer） Basic idea of Layout board layer Second floor board: there are two layout techniques for the second layer. One is the older technology, which is applicable to lower speed components, which generally include the components of DIP packaging or the matrix alignment, which is rarely used now. The first way: Take power and Ground to grid layout, so that the total area of formation is less than 1.5 inches square. Trace of Power and Ground is distributed at a 90-degree Angle. Power is on one floor and ground is on the other. The Ground trace is on the top and the vertical direction. The Power trace is placed at the bottom level, and the horizontal direction is placed at each ground and trace junction to place the capacitance. The second way: This is usually used for less than 10kHz low-frequency analog design. To reduce the total length of trace, the power trace is connected to each component of the same layer of wiring. Put all power and ground trace next to the wiring. This can make the loop current from the high frequency switching noise is the smallest, so that other circuits and control signals will not be affected. And the only way that this trace will separate is when you connect to the capacitance. The signal flow is in parallel with the ground path. Avoid different branches to cross each other to avoid causing ground loop. Low frequency parasitic inductance and capacitance usually do not produce problems. In this case, a single point of grounding is recommended. In terms of low frequency application, the high frequency performance is achieved by layout. Note the following two points: At high frequency, the surface impedance of the path and its return current path is controlled. At low frequencies, control the shape of the layout rather than the impedance. Four floors: there is only one way to stack the four-ply stack. With power and ground, EMIs features have improved greatly. However, the effect of the four-layer b