CPU的封装方式有多少种（There are many ways to encapsulate the CPU）.docVIP

CPU的封装方式有多少种（There are many ways to encapsulate the CPU） Encapsulation technology is a technique for packaging integrated circuits with insulated plastic or ceramic materials. Take CPU as an example, the size and appearance we actually see is not the size and face of the real CPU kernel, but the product of the CPU kernel, which has been encapsulated. Encapsulation is essential and critical for a chip. Because the chip must be isolated from the outside world to prevent impurities in the air on the chip circuit corrosion, resulting in electrical performance degradation. On the other hand, the encapsulated chip is also easier to install and transport. Because the packaging technology has a direct impact on the performance of the chip itself and the connection with the PCB (printed circuit board) design and manufacture, therefore, it is essential. The package can also be said that refers to the installation of a semiconductor integrated circuit chip with the shell, it not only plays placed, fixed and sealed to protect the chip and enhanced thermal conductivity, contact and communication with the outside world circuit chip chip bridge with wire connected to the package pins, the pins and the the wire on the printed circuit board to connect with other devices. Therefore, for many integrated circuit products, packaging technology is a crucial link. At present, the CPU packages are mostly wrapped in insulated plastic or ceramic materials, and can play a role in sealing and improving the thermal performance of chips. Because of the higher and higher internal frequency of processor chips, more and more functions, more and more pins, the package shape is changing constantly. Main considerations in packaging: The chip area and the package area ratio are improved, and the encapsulation efficiency is as close as possible to the 1:1 Pins should be as short as possible to minimize delay and inter pin distance as far as possible in order to ensure no interference and improve perform