滤波电容和去耦电容（Vertical mill reducer manual）.docVIP

滤波电容和去耦电容（Vertical mill reducer manual） How do you calculate the valid node in the schematic diagram of AD6? Also, yes, how many pads are available because I can quote the quantity of the solder. Two The signal layer (Signal Layers), a 16 signal layer, TopLayer BottomLayer MidLayer1-14. The internal power / ground (Internal Planes), there are 4 power / ground Planel1-4. The mechanical layer (Mechanical Layers), there are four layers of machinery. The drilling position, layer (Drill Layers), mainly used to draw the map and borehole drilling position, including Drill Guide and Drill drawing two. The solder layer (Solder, Mask), TopSolderMask and BottomSolderMask two, manual tin. 6, solder paste protective layer (Paste Mask) TopPaste and BottomPaster two. 7, silk screen layer (Silkscreen), TopOverLayer and BottomOverLayer two, mainly used for contour drawing element. Therefore, other working level (Other): KeepOutLayer: prohibits wiring layer, used to draw the printed board, the outer border and positioning holes and other hollow parts. MultiLayer: multilayer A semiconductor device includes a plurality of wiring layers of the first insulating film; formed on the first insulating film on the first wiring layer is formed on the first wiring layer; the second wiring layer; and disposed on the first insulating film and the first wiring layer, between adjacent wiring and the second wiring layer second the wiring layer wiring and the lower side of the first insulating layer between the first wiring layer and the low dielectric constant insulating film second. A method for manufacturing the semiconductor device forming a first interlayer insulating film; forming a plurality of wiring groove on the first interlayer insulating film; the metal film embedded in the wiring groove to form a plurality of wiring; removing the wiring between the first interlayer insulating film to form buried in the ditch; the buried trench buried second layer is composed of a low dielectric constant