26 - InTech（InTech 26 -的哲理）.pdf

26 Material Characterization and Failure Analysis for Microelectronics Assembly Processes 1,2 1 Chien-Yi Huang , Ming-Shu Li , 1 1 1 Shan-Yu Huang , Cheng-I Chang and Min-Hui Huang 1 Process Technology Enabling Materials Characterization Div. Operations, Wistron Corporation, Hsinchu 300, Taiwan, 2Department of Industrial Engineering and Management, National Taipei University of Technology, Taipei 106, Taiwan, R.O.C. 1. Introduction In recent decades, the electronic industry has shown a clear trend towards miniaturization with increasing functionality. In the context of essential competition within the market, the reliability of long term operations has become a popular issue. This study examines the properties of printed circuit board (PCB) and its failure phenomena. PCB reliability is characterized through verifications taken from various process conditions. Notably, results can be used as selection criteria for PCB materials, helping to reduce PCB delamination during the assembly process. In addition, surface finish is a key factor seen to affect