Photolithography - Wake Forest University（光刻-维克森林大学）.pdf

Photolithography Source: Dr. R. B. Darling (UW) lecture notes on photolithography Why Lithography? • Simple layers of thin films do not make a device. • To create a device such as a transistor, layers of thin films have to be patterned, etched and A MOSFET Device coated. • Lithography combines these processes and can create millions of devices in batch. The MOSFET as patterned on a wafer What is Lithography? • Lithography is the transfer of geometric shapes on a mask to a smooth surface. • The process itself goes back to 1796 when it was a printing method using ink, metal plates and paper. • In modern semiconductor manufacturing, photolithography uses optical radiation to image the mask on a silicon wafer using photoresist layers. • Other methods are electron beam, scanning probe, X-ray and XUV lithography. Steps Used in Photolithography • Surface cleaning • Barrier layer formation (Oxidation) • Spin coating with photoresist • Soft baking • Mask alignment • Exposure • Development • Hard baking • Post process cleaning Wafer Cleaning - 1 • Typical contaminants that must be removed prior to photoresist coating: – dust from scribing or cleaving (minimized by laser scribing) – atmospheric dust (minimized by good clean room practice) – abrasive particles (from lapping or CMP) – lint from wipers (minimized by using lint-free wipers) – photoresist residue from previous photolithography (minimized by performing oxygen plasma ashing) – bacteria (minimized by good DI water system) – films from other sources: • solvent residue • H O residue 2 • photoresist