ProcessModule说明A下料（CutLamination）a-1裁板.ppt

* * Process Module 說明 : A. 下料 ( Cut Lamination) a-1 裁板 ( Sheets Cutting) a-2 原物料發料 (Panel)(Shear material to Size) B. 鑽孔 (Drilling) b-1 內鑽 (Inner Layer Drilling ) b-2 一次孔(Outer Layer Drilling ) b-3 二次孔 (2nd Drilling) b-4 雷射鑽孔 (Laser Drilling )(Laser Ablation ) b-5 盲(埋)孔鑽孔 (Blind Buried Hole Drilling) C. 乾膜製程 ( Photo Process(D/F)) c-1 前處理 (Pretreatment) c-2 壓 膜 (Dry Film Lamination) c-3 曝 光 (Exposure) c-4 顯 影 (Developing) c-5 蝕銅 (Etchi