A Practical Guide to Design Assembly and （设计组装和实用指南）.pdf

A Practical Guide to Design Assembly and Reflow of Through Hole Components Produced by Bob Willis SMART Group 86 Easton Street High Wycombe Buckinghamshire HP11 1LT England Tel: (44) 01494 465217 Fax: (44) 01494 473975 Email: info@ Web: This is the fourth special report produced by the SMART Group for the benefit of its members and for others in the industry. As in the past the profits from the sale of this report will be donated to charity. Over the last couple of years the Group has been able to raise over £2000 from these activities. We would like to again take the opportunity of thanking Bob Willis for personally volunteering his time and effort in producing these technology reports for our industry. Also thanks to members of the Committee for reviewing the report. The full results and an introduction to Pin In Hole Design and Assembly can be provided by The SMART Group as an in-house Workshop. A video tape will also shortly be available to SMART Group members. For further details on reports, workshops or videos contact your local SMART Group office. The next SMART Group report will be available in March “A Practical Guide to Double Sided Reflow Soldering” which will provide members with a special guide to processing assemblies. Tony Gordon SMART Group Secretary All text and illustrations are © Bob Willis The spread sheet example is © Alan Hobby, DEK Printing Machines A Practical Guide to Design Assembly and Reflow of Through Hole Components Surface Mount Technology (SMT) is now part of mainstream electronic assembly with virtually all market sectors benefiting from the use of SMT. One feature that has always proved a problem to design and