45nm工艺及材料的最新动态 45 nm Technology and its Equipment.pdfVIP

电子工业专用设备 趋势与展望 Eguipment for Electronic Products Manufacturing 45nm 工艺及材料的最新动态 翁寿松 ! # 无锡市罗特电子有限公司 江苏 无锡 2 14001 摘 要 介绍了 芯片 工艺和设备的最新动态 英特尔 特许 英飞凌和三星都推出 ! 45 nm ! !TI !IBM ! ! 了 功能芯片 主要工艺包括光刻 应变硅 低 电介质 互连 高 电介质和离子 45 nm 45 nm ! ! k !Cu ! k 注入等 光刻工艺采用 193 nm ArF/ 浸没式光刻机 45 nm 工艺中应变硅技术已步入第三代#它综 ! 合采用双应力衬垫 应力记忆和嵌入 SiGe 层 ! $ $ $ 关键词 45 nm 芯片 45 nm 工艺 45 nm 设备 应变硅技术 中图分类号! 文献标识码! 文章编号! TN405 A 1004-4507 （2006）11-0009-04 ! nm Technology and its Eguipment WENG Shou-song ( Wuxi Luo Te Electronic Co., Ltd, Wuxi 2 14001, China ) Abstract : In this paper, recent development of the 45 nm chip, technology and eguipment are intro- duced. The 45 nm functional chips are manufactured by Intel, TI, IBM, chartered, Infineon and Sam- sung. The 45 nm main technology includes lithography, strained silicon, low -k dielectric, Cu intercon- nection, high-k dielectric and ion implantation etc. The lithography adpot the 193 nm ArF/immersion lithography eguipment. The strained silicon technology is treaded to the third-generation strained silicon in the 45 nm technology . The double stress liner (DSL), the stress memory and the embedded SiGe are c