High Speed Solder Ball Shear and Pull Tests vs. （高速焊球剪力和拉力测试vs。）.pdf

High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed 1 1 2 3 3 Fubin Song , S. W. Ricky Lee , Keith Newman , Bob Sykes , Stephen Clark 1EPACK Lab, Center for Advanced Microsystems Packaging, Hong Kong University of Science Technology 2SUN Microsystems 3DAGE Holdings Limited Abstract Due to space constraints, however, this paper describes results for a single 316 PBGA (27 mm x 27 mm) This study compares high-speed bondtesting (shear and construction, using Sn4.0%Ag0.5%Cu (SAC405) solder balls, pull) with board level drop testing (BLDT) of BGA packages but fabricated with different surface finish options: electroless using Sn4.0%Ag0.5%Cu solder balls and either an ENIG or nickel immersion gold (ENIG), and organic solderability OSP package substrate surface finish. High-speed shear and preservative (OSP). pull testing were carried out at various speeds; failure modes