MEMS and Sensors Whitepaper Series Plasma （微机电系统和传感器白皮书系列等离子体）.pdfVIP

MEMS and Sensors Whitepaper Series Current Trends with DRIE/DSE™ Processing for MEMS Devices and Structures September 2012 Whitepaper Topics: MEMS, sensors, DRIE, DSE, Bosch process, dry etching, plasma etching, fab process equipment, 3D silicon structures, SOI, TSVs. About Us: Plasma-Therm is a U.S. based manufacturer of etch and thin film deposition equipment for a number of global compound semiconductor and related specialty markets. For more than 35 years, we have enabled various process technologies by coupling reliable platforms with award-winning service. Plasma-Therm holds over 24 patents for innovation in plasma process technologies, spanning photomask and silicon-based solutions, particularly in relation to deep silicon etch for MEMS applications. For more information, please visit . Contact Information: Thierry Lazerand (thierry.lazerand@) Technical Marketing Manager Plasma-Therm () Current Trends with DRIE/DSE™ Processing for MEMS Devices and Structures Introduction Led by the emerging consumer market, the MEMS industry has experienced a tremendous windfall after recovering from the global economic recession. In 2010, the MEMS market grew by twenty percent with an expected continued annual double-digit growth through 2015. Higher demands in consumer, industrial, medical, automotive, biomedical and other applications, the MEMS market is outperforming the overall semiconductor market by at least a factor of two. This growth is fuelling the need for more sophisticated, more efficient and higher performance processing equipment, and in particular, plasma etching systems used for out-of-plane structures, such as through-silicon vias (TSVs) and other features for MEMS devices. Deep Reactive