New Applications of CMP for NonTraditional （新应用程序的非传统CMP）.pdfVIP

New Applications of CMP for Non-Traditional Semiconductor Manufacturing Robert L. Rhoades, Ph.D. Entrepix, Inc. SEMICON Taiwan 2006 SEMICON Taiwan 2006 Outline Introduction New Applications of CMP MEMS Non-CMOS Devices New Materials Epitaxial Layers and Engineered Substrates Direct Wafer Bonding Summary and Future Outlook SEMICON Taiwan 2006 SEMICON Taiwan 2006 Introduction CMP has been a mainstream process 15 years CMP processes in CMOS flow include: Oxide (pre-metal or interlevel dielectric planarization) Tungsten (contacts, plugs, local interconnect) Shallow trench isolation Copper dual damascene Other technologies are now adapting CMP to solve planarization challenges Some require only process modifications … and some require new pads and/or slurries SEMICON Taiwan 2006 SEMICON Taiwan 2006 CMP Process Complexity Wafer / Materials Parameters Process Issues Size / Shape / Flatness Long list of significant input variables Film Stack Composition Downforce Metals (Al, Cu, W, Pt, etc.) Platen speed Oxide (TEOS, PSG, BPSG, etc.)