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方形扁平无引线qfn封装的研究及展望 development and view of qfn package
趋势然卷咿O叫∞k衄dFlm时炉
方形扁平无引线QFN封装的研究及展望
陈建明，翁加林，陈学峰，吾玉珍
(苏州固锝电子股份有限公司，江苏苏州215011)
结合发展起来的先进封装形式，是sMT技术中产品体积进一步小型化的换代产品。讨论了QFN
技术的改进及工艺自动化发展进程，指出其必将成为半导体器件高端主流封装形式之一。
关键词：封装；无引线封装；半导体器件
中图分类号：7Ⅲ305．94文献标识码：A
view
of Package
DeVdopment粕dQFN
CHEN CHEN Yu—zh朗
Jia—lin，
Jian—ming，WENG Xue—feng，WU
(s础ou)o如船眈咖，
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