银导体连线技术-国家奈米元件试验室.PDF

4 26 Silver Interconnect Technology Intel 22 Fin FET 10 10 Abstract In v iew of commercial elect ronic product requirements, t he integrat ion circuit (IC) manufact uring technology needs to keep mov ing to f ulf ill mult iple purposes. Not only t he architect ure of dev ice changes f rom planar 2D to 3D for high speed, low power operation but also the breakthrough of functional materials in special process provides higher feasibility in device performance enhancement. In past decade, better performance was achieved using copper in place of aluminum. We wonder t hat Cu NANO COMMUNICATION 20No.1 27 will be still suitable for next 10 years or be replaced by another new material, like silver, carbon nanotube, g