Capabilities of Flip Chip Defects Inspection （倒装芯片的功能缺陷检查）.pdf

Capabilities of Flip Chip Defects Inspection Method by Using Laser Techniques Sheng Liu and I. Charles Ume* School of Mechanical Engineering Georgia Institute of Technology Atlanta, Georgia 30332 (404) 894-7411(P) charles.ume@ * Corresponding Author Achyuta Achari Visteon Corporation Technical Center – Dearborn Suite C-140 17000 Rotunda Drive Dearborn, MI 48120 Aachari@ 313-755-7513 (P) Juergen Gamalski Siemens AG Corporate Technology Packaging and Assembly CT MM 6 D-13623 Berlin juergen.gamalski@blns.siemens.de +49 30 386-26455(P) The International Journal of Microdircuts and Electronic Packaging, Volume 24, Number 2, Second Quarter, 2001 (ISSN 1063-1674)   International Microelectronics and Packaging Society  122 Abstract A novel, non-contact, nondestructive approach for flip chip solder joint quality inspection is presented. In this technique, a pulsed laser generates ultrasound on the chip’s surface. An interferometer was used to measure the displacement at chip’s surface. Changes in solder joint quality produce a different surface displacement response. An “Error Ratio” method of analysis is used to distinguish a good chip from a chip with defect. Capabilities of this defects inspection method are discussed in this paper. Experimental results indicate that this laser ultrasonic/ interferometric system is capable of detecting various defects such as missing solder ball/ undersized solder ball, surface defects on silicon die such as crack, and misalignment of solder bumps, in a fast and efficient way. A fully developed system can be used on-line for quality assurance or off-line for process