COF (ChipOnFilm) Technology for LCD Driver （咖啡(ChipOnFilm)技术对LCD驱动程序）.pdf

COF (Chip-On-Film) Technology for LCD Driver ICs Using Reel-to-Reel System Kenji Toyosawa* Nakae Nakamura* Kazuhiko Fukuta* Yasunori Chikawa* * Module Assembly application engineering Dept., LCD LSI Division, Integrated Circuits Group Abstract We developed a so-called reel-to-reel method COF technology using a long carrier tape for the LCD driver package. This method enables mass production of COF. We used the ILB (inner lead bonding) technique that connects inner leads on a 2-layered tape (glue-less) to Au bumps on an IC chip. COP tape material should be carefully selected with respect to both thermal expansion and heat resistance, because the IC chips are connected to the tape at a temperature over 400 C. In cooperation with a resin maker, we developed the underfill material, which enables filling the narrow spaces between the IC chip and the 2-layered chip without bubbles. The 2-layered tape also features easy installation onto CR parts and is flexible enough to bend freely. These features offer a promising advantage when this method is applied to compact appliances such as cellular phones and PDAs. Introduction At present, TCP (tape carrier package) is widely being used as a package for LCD driver ICs. Sharp first began using TCP assembly processes for LCDs in 1985, and we have developed a number of TCP technologies, Slits becoming a leader in the TCP industry. COF (chip-on-film) was first introduced in 1998 as a replacement for TCP. Since the summer of 2000, its use has advanced extremely rapidly with the evolution of larger color displays for mobile phones, and demand for COF has grown even stronger. Figs. 1 and 2 show, respectively, photographs, and top views and cross-sectional views of TCP and COF packages. COF TCP external appearance