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Detection of Cracked MultiLayer Ceramic (检测了多层陶瓷)
Detection of Cracked Multi-Layer Ceramic
Capacitors on Printed Circuit Board Assemblies
Michael H. Azarian, Ph. D.
IMAPS Chesapeake Chapter Summer Technical Symposium
July 23, 2014
Center for Advanced Life Cycle Engineering 1 University of Maryland
Copyright © 2014 CALCE
Flex Cracks in Multi-Layer Ceramic
Capacitors (MLCCs)
Ceramic dielectric Electrode Flex crack Capacitor
termination
Solder joint
Printed circuit
board Solder pad
Flex crack
250 mm
Center for Advanced Life Cycle Engineering 2 University of Maryland
Copyright © 2014 CALCE
Background
• MLCCs are susceptible to cracking due to board flexure or
thermal stress.
• Cracked capacitors can affect circuit performance, and cause
open or short circuits, and even fires.
• Cracked MLCCs are difficult to detect non-destructively after
assembly, due to:
– their small size,
– curved end terminations,
– multilayer construction of the MLCC and the board,
– interference by electrical and mechanical elements of the PCB circuitry,
– minimal change in electrical performance if cracks are small, and
– the inability to apply large voltages or mechanical stresses.
Center for Advanced Life Cycle Engineering 3 University of Maryland
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