基于微通道致冷的大功率led阵列封装热分析 thermal analysis of high power led array packaging with microchannel cooler.pdfVIP

SEMICONDUCTOR OPTOELECTRONICS Vol. 27 No. 6 Dec. 2006 光电器件 基于微通道致冷的大功率LED 阵列封装热分析 1 1 1 2 袁柳林 ，刘 胜 ，陈明祥 ，罗小兵 （华中科技大学1. 微系统研究中心；2. 能源与动力学院，湖北 武汉430074 ） 摘 要： 采用微通道致冷技术，设计了大功率LED 阵列封装的微通道致冷结构，并应用热分 析软件模拟了其热性能，探讨不同鳍片结构尺寸、流速、功率等参数对LED 多芯片散热效果的影 响。文中提出了采用交错通道以提高LED 封装的散热能力，模拟结果显示，交错微通道致冷的封 装结构能很好地满足大功率LED 阵列的散热需要。 关键词： 大功率LED ；微通道；交错鳍片；散热；封装 中图分类号：TN312 . 8 文献标识码：A 文章编号：100 1 - 5868（2006 ）06 - 07 12 - 05 Thermal Analysis of High Power LED Array Packaging with Microchannel Cooler YUAN Liu-lin1 ，LIU Sheng1 ，CHEN Ming-xiang1 ，LUO Xiao-bing2 （1. Institute of Microsystems ；2. Institute of Energy and Power ， Huazhong University of Science and Technology ，Wuhan 430074 ，CHN ） Abstract ： The packaging structure of high power LED arrays integrated with microchannel cooler has been discussed. Detailed heat transfer performance has been analyzed using the finite element analysis（FEA ）technology. The effects have been discussed on the cooling of multi-chip LED module with different internal fin geometry of module ，velocity of flow and total power. The cooling scheme has been optimized by using staggered fins in microchannel coolers to increase the heat transfer coefficient of the multi-chip LED module packaging. The result shows that the packaging structure of the microchannel cooler with staggered fins can achieves good thermal performance for high power LED array. Key words ： high power LED ；microchannel ；staggered fins ；cooling ；packaging 1 引言 和芯片寿命降低（为了保证LED 芯片的寿命，一般