平面零收缩ltcc基板制作工艺研究 study of plane zero-shrink ltcc substrate manufacturing process.pdfVIP

第13卷第10期 电　子　与　封　装 第13卷，第10期 电　子　与　封　装 总 第126期 Vol.13 ，No.10 ELECTRONICS PACKAGING 2013年10月 平面零收缩LTCC基板制作工艺研究 何中伟，高　鹏 （北方通用电子集团有限公司微电子部，江苏苏州 215163 ） 摘　要：LTCC基板的共烧收缩均匀性受到材料和加工工艺的影响较大，使烧成基板的平面尺寸难以 精确控制，成为LTCC基板实现高性能应用的一大障碍，需要重点突破。文章在简要介绍了常见平面 零收缩LTCC基板制作工艺技术的基础上，通过精选LTCC生瓷带并设计10层和20层LTCC互连实验基 板，提出评价指标，根据自有条件开展了自约束烧结平面零收缩LTCC基板的制作工艺研究，重点突 破了层压与共烧工艺，将LTCC基板平面尺寸的烧结收缩率不均匀度由通常的±0.3%~±0.4% 减小到小 于±0.04% ，可以较好地满足高密度高频MCM研制的需要。 关键词：LTCC ；平面零收缩；收缩率不均匀度；层压；共烧 中图分类号：TN305.94 　 文献标识码：A　　 文章编号：1681-1070 （2013 ）10-0014-05 Study of Plane Zero-shrink LTCC Substrate Manufacturing Process HE Zhongwei, GAO Peng （Micro Electronics Institute of NGEG Co ., Ltd , Suzhou 215163, China） Abstract: Because the co-firing shrink uniformity of LTCC substrate is largely affected by material and manufacturing process, it makes the precision control of the co-fired substrate plane dimensions very difficult, and that becomes a major obstacle of LTCC substrate in high performance applications, so it need to be broken through. This paper introduced several common plane zero-shrink LTCC substrate manufacturing technologies briefly, and by sensible selection of LTCC tape, designing 10 and 20 layer LTCC connecting test substrates, and putting forward the evaluation pass standard, it carried out the study of self-constraint sintering plane zero-shrink LTCC substrate manufacturing process on ourselves facilities, and stressly broke through the processes of laminating and co-firing. It reduced the firing shrinkage disuniformities of X and Y dimensions of LTCC substrate to