聚合物多层微流控芯片超声波键合界面温度研究.PDF

第20卷摇 第1期 材摇 料摇 科摇 学摇 与摇 工摇 艺 Vol.20 No.1 摇 摇 20 12年2月 MATERIALS SCIENCE TECHNOLOGY Feb. ,2012 摇 摇 摇 摇 摇 摇 聚合物多层微流控芯片超声波键合界面温度研究 罗摇 怡,何盛强,王晓东 (辽宁省微纳米技术及系统重点实验室,大连理工大学,大连 116024,luoy@dlut.edu.cn) 摘摇 要:针对聚合物多层微流控芯片键合,采用热辅助超声波键合方法实现了4 层微流控芯片的键合,搭建 了多界面温度测试装置,采用埋置热电偶的方法测试了三个被封接界面的温度场,研究了单独超声波作用和 热辅助超声波键合法中各界面的温度并进行了比对.温度测试实验结果表明,在顶层热辅助温度70益、6滋m 振幅、30kHz 频率、100N超声波焊接压力和25s超声波作用时间下,基于热辅助的多层超声波键合方法可以 使各键合界面的温度基本一致,从而实现多层微流控器件的多个界面键合质量一致.本文的研究为聚合物微 流控器件的超声波多层键合机理研究提供了有益借鉴. 关键词:多层微流控芯片;热辅助超声波键合;界面温度 中图分类号:TN106 文献标志码:A 文章编号:1005-0299(2012)01-0088-05 Interfacial temperature study of multi鄄layer ultrasonic bonding for polymer microfluidic chip LUO Yi,HE Sheng鄄qiang,WANG Xiao鄄dong (Key Laboratory for Micro/ Nano Technology and System of Liaoning Province,Dalian University of Technology, Dalian 116024,China.E鄄mail:luoy@dlut.edu.cn) Abstract:Usingthermal assistedultrasonicbonding method,four鄄layer microfluidic chipwasbonded.Multi鄄in鄄 terface temperaturemeasurement system was established,thermal couples were embedded at the three bonding interface togetthetemperatureinformation.Ultrasonicheatandthermalassistedultrasonicheatingexperiments were carried out and the results were compared to each other.The experimental results show that when the thermal assistedtemperatureofthetoplayerwascontrolledat70益,undertheultrasonicparametersof:6滋mof amplitude,30kHz of ultrasonic frequency,100N of ultrasonic bonding force and 25s of ultrasonic time,multi鄄 layer microfluidicchipwassuccessfullybonded.Theworkisusefultostudythemechanismofmulti鄄layerultra鄄 sonic bonding