铜表面微蚀处理新技术.pdfVIP

A pr. 2008 Vol. 30 No. 4 Serial No . 18 1 4 Pla ing and F inishing : 1001- 3849( 2008) 04- 0004- 04 1 1 2 2 3 3 郑 博 , 江建平 , 寇文鹏, 吴荣生 , Joe Abys , Simon WANG ( 1, 638382; 2 , 518055; 3Eh hone Inc. , CT 065 16, ) : 采用过硫酸盐和几种特别添加剂配制成的微蚀剂, 仅具有传统微蚀剂的优点, 而且拥有其 独特的优点: 微蚀处理的铜表面比传统微蚀剂处理的光亮; 微蚀处理后暴露在空气中10 min, 铜表 面也 变色; 微蚀处理后的元件没有原电池腐蚀现象发生; 其工作溶液比传统微蚀剂稳定; 微蚀速 率容易控制以满足 同的微蚀要求; 微蚀处理 影响精密线路板和元件的尺寸 : 新微蚀剂; 微蚀速率; 抛光; 原电池腐蚀 : T G17442 : A Advanced Copper Microetching Technology 1 1 2 2 3 ZHEN G Bo , JIA N G Jian- ping , KOU W en- peng , Sam N G , Joe Abys , 3 Simon WAN G ( 1. En hone Chem is ry, Singapore 638382 ; 2. Guangzhou Cookson En hone T rading Co. , L d. , Shenzhen Guangdong 518055 , China; 3. Eh hone Inc. , CT 06516, U SA) Abstract: A novel copper microe ching echnology is repor ed. T his echnology is o presen an ad- vanced copper microe chan , combining persulfa e and some unique addi ives. Besides keeping he pos- i ive fea ures of he conven ional microe chan s, his adv anced copper microe chan possesses he fol- lowing addi ional advan ages: e ched copper surface is brig h er han ha rea ed by conven ional me h- ods; e ched copper surface does no arnish even being ex posed o air for en minu es; no galv anic cor- rosion occurs in his microe ched subs ra e; working solu ion is more s able han conven ional ones; e ching ra e is easy o be con rolled so as o ca er for differen requirm en s; his m icroe chan does no aff ec he dim ension of f ine prin ed wiring boards or precious s