倾斜梳齿MEMS电容式传感器惯性脉冲响应特性研究.pdfVIP

5 Vol. 36 No. 5 2008 5 ACTA ELECTRONICA SINICA May 2008 MEMS 1 2 1 1 董林玺, 颜海霞, 钱 , 孙玲玲 ( 1. CAD , 310018; 2. , 311504) : DRIE( Deep Reactive Ion Etchin ) . , MEMS , DRIE . , , , . , , DRIE . DRIE , MEMS , ANSYS , . : ; ; ; MEMS : TN43 : A : ( 2008) St udy of Inertial Pulse Response of MEMS Capacitive Accelerometer wit h NonParallel Combs 1 2 1 1 DONG Linxi , YAN Haixia , QIAN Xian , SUN Lin lin (1. Microelectronic CAD Center of Hangzhou Dianzi University, Hangzhou, Zhej iang 310018, China; 2. Toshiba Hy roElectro Equipments Comp any ,Hangzhou, Zhej iang 311504, China) Abstract: The combs of the comb capacitive inertial sensors fabricated by a deep reactive ion etchin ( DRIE) are usually not parallel. In this paper , inertial pulse response of MEMS capacitive accelerometer w ith nonparallel combs is studied considerin the air dampin in low vacuum, and the effects of DRIE process on performance of the microaccelerometer are analyzed. The re sults show that for doublesided structure, the nonparallel comb factor influences the displacement caused by outside acceleration and decreases the linearity ran e of inertial pulse response of the sensors, as the air pressure becomes smaller, the effects are more obvious. For doublesided structure with feedback volta e, the feedback force decreases the sensitivity of pulse inertial si nal, but the effects of DRIE on the performances of the sensor become smaller compared to the structure without feedback volta e. T o restrai