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pcb沉金工艺流程及其工艺控制技巧（PCB gold process and process control techniques）.doc

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pcb沉金工艺流程及其工艺控制技巧（PCB gold process and process control techniques）

pcb沉金工艺流程及其工艺控制技巧（PCB gold process and process control techniques） PCB gold immersion process and its process control skills Release date: 2009.01.04 Author: admin read: 92 I. brief introduction of process The purpose of the gold deposition process is to deposit nickel coating on the printed circuit surface with stable color, good brightness, good coating and good weldability. Basically can be divided into four stages: pretreatment (degreasing, micro corrosion, activation, after immersion), sink nickel, sink gold, after treatment (waste gold, water, DI washing, drying). Two. Pretreatment Gold pretreatment generally have the following steps: removing oil (30? 482), microetch (60g/InaPS, 2%H2SO4), activation (10 Chun -354-2), after leaching (1%H2S04). In order to remove the copper surface oxide, and sink the palladium in the copper surface to be used as the precipitating nickel activation center. One of these processes is not good, which will affect the subsequent deposition of nickel and gold, and lead to the rejection of bulk properties. In the production process, all kinds of potions must be regularly analyzed and supplemented, controlled within the required range. For example, the more important: Micro etch rate should be controlled in the 25U? 40U, the activation of copper content is more than 800PPM drops must open new cylinder, affect the quality of cleaning and maintenance of PCB potion cylinder of the antithetical couplet is large, in addition to microetch cylinder, cylinder, cylinder should be dipped after every week for each cylinder, cylinder should also be washed every week. Cleaning. Three, sink nickel The main component of electroless nickel drops for Ni? (5.1-5.8g/1) and reducing agent sodium hypophosphite (25-30g/1) and a stabilizer for more stringent requirements due to chemical nickel syrup composition range, each class must test two times in the production process, and according to the production of plate area of bare copper or experience adding re