元器件封装（Packaging components）.docVIP

元器件封装（Packaging components） Component encapsulation Encapsulation means the connection of a circuit pin on a silicon chip to the external joint by wire lead so as to connect with other devices. It not only plays the installation, fixed and sealed to protect the chip and enhanced electric properties and other aspects of the role, but also through the contact chip with a wire connected to the package pin, the pin is connected by wires on the printed circuit board and other devices, so as to realize the connection of internal and external circuit chip. Because the chip must be isolated from the outside world to prevent impurities in the air on the chip circuit corrosion, resulting in electrical performance degradation. On the other hand, the encapsulated chip is also easier to install and transport. Component packaging (Footprint), or component form name, is designed to provide circuit board design, in other words, component packaging is the component of a circuit board. Because the packaging technology has a direct impact on the performance of the chip itself and the connection with the PCB (printed circuit board) design and manufacture, therefore, it is essential. An important indicator of whether a chip packaging technology is advanced or not is the ratio of chip area to package area, and the closer the ratio is, the better the 1 is. Main considerations in packaging: 1, the chip area and the package area ratio to improve the packaging efficiency, as close as possible to 1:1; 2, the pin should be as short as possible to reduce the delay, the distance between pins as far as possible, in order to ensure mutual interference and improve performance; 3, based on the requirements of heat dissipation, the package is thinner, the better. Packaging is mainly divided into DIP, dual in line and SMD chip packaging two. From the aspect of structure, the TO transistor package through the early (TO-89, TO92) package to the development of the dual in line package, followed by the PH