TF外焊自弹卡座.pdfVIP

Document No. Page:1/4 Rev. A HOAU T-FLASH 卡座PUSH/PUSH Written Checked Approved Jany Jeff Ag 1.0: SCOPE This specification covers the requirements for product performance and test methods of the micro SD (push to push ) connector. Product shall be of the design, construction and physical dimensions specified in the applicable product drawing 2.0: Rating: 2.1 Current rating: 0.5A AC/DC Min 2.2 Rated voltage: 100V RMS 2.3 Operating Temperature: -25ºC~+85ºC Storage Temperature:-40ºC~+85ºC （500hours ） 2.4 Relative humidity: 95%Maxmum (non-condensing) 3.0: Test Condition: 3.1 Temperature range: 20ºC +5ºC 3.2 Humidity range: 25%~85% 4.0: Test Methods and Requirements: 4.1 Examination of product: Item Test Test Methods Requirement Description 4.1.1 Examination Shall be confirmed with eyes in accordance with Outward appearance shall of product each drawing. be good without such injurious problem. 4.2 Electrical Performance: Item Test Test Methods Requirement Description 4.2.1 Contact Mate card measured dry circuit, 20 m volts Max. 100 mΩ Max. Initial Resistance 10mA Max 100+/-40mΩ Max. Final 4.2.2 Insulation