ccga焊柱受力状态下热疲劳寿命的研究 fem analysis on thermal fatigue life of ccga column under compressive load.pdfVIP

电子工艺技术 年 月 第 卷第 期 Electronics Process Technology 333 2013 11 34 6 CCGA焊柱受力状态下热疲劳寿命的研究 吕强，尤明懿，管宇辉，陈甲强 （中国电子科技集团公司第三十六研究所，浙江 嘉兴 314033） 摘　要：分析了CCGA器件在星载设备中的受力状态。采用非线性有限元分析方法和统一型粘塑性Anand本 程，分析了力载荷对焊柱热疲劳寿命的影响。研究结果表明，力载荷在热循环条件下虽然对焊柱的应力影响不 大，但对焊柱的塑性应变累积有明显的加剧作用，从而使焊柱的热疲劳寿命有显著降低，减少力载荷有利于提 高焊柱的热疲劳寿命。 关键词：CCGA；Anand；Coffin-Manson；热疲劳寿命；有限元 中国分类号：TN60　文献标识码：Ａ　文章编号：1001-3474（2013）06-0333-04 FEM Analysis on Thermal Fatigue Life of CCGA Column Under Compressive Load LV Qiang, YOU Ming-yi, GUAN Yu-hui, CHEN Jia-qiang ( No.36 Research Institute of CETC, Jiaxing 314033, China ) Abstract: Compressive load effect on CCGA devices for space applications is analyzed. CCGA column was regarded as a target, the nonlinear fi nite element method and the unifi ed visco-pasctic Anand equation were employed to develop the 3D fi nite element model base on hest strain damage. The effect of compressive load on thermal fatigue life was studied using a modifi ed Coffi n-Manson relationship. Results indicate that compressive load does not appear to affect the equivalent stress under Thermal cycles, but fatigue life is signifi cantly degraded with equivalent strain pick up cumulate by compressive load. Reduce compressive load can improve the fatigue life of CCGA column. Key Words: CCGA; Anand; Coffi n-Manson; Thermal fatigue life; Finite element Document Code: A Article ID: 1001-3474,2013,06-0333-04 CCGA是CBGA概念的延伸。细长和柔软的焊柱能 后也没有出现焊柱损坏和电性能异常的现象[3]。 更好地适应陶瓷基板和PCB之间的热应力，焊点上的应 上述研究通过试验方法，验证了力载荷对CCGA 力将通过焊柱的弯曲来进行释放，从而提高器件的热 器件可靠性的影响。目前国内在这方面的研究较 [1,2] 疲劳性能。但这些特性却更容易导致机械损害 。 少，尚未查到相关文献。随着CCGA器件在星载设备 有研究发现，32.5