50mm50mm精细线路制作探讨 50μm50μm ifne line production.pdfVIP

印制电路信息 2014 No.4 图形形成与蚀刻 Pattern Formation and Etching 50mm/50mm精细线路制作探讨 Paper Code: S-003 孟昭光 冉彦祥 叶 志 （东莞市五株电子科技有限公司，广东 东莞 523290 ） 摘 要 随着未来手机及数码相机等3G/4G产品的轻、薄、小型化与多功能化发展趋势，线路 的精细化程度逐步转向亚微观、微观的微米级尺度，线路的精密要求也大大提高。文 章通过典型的三阶三压板的制作过程，从物料选择、设备选择、线路解析度、蚀刻均 匀性控制、面铜均匀性控制、线路补偿等方面探讨50 m/50 m精细线路HDI板最佳制作 m m 方法，对细线路的制作有一定的参考价值。 关键词 精细线路；解析度；蚀刻均匀性、面铜均匀性；动态补偿 中图分类号：TN41 文献标识码：A 文章编号：1009-0096（2014）04-0001-08 50µm/50µm fine line production MENG Zhao-guang RAN Yan-xiang YE Zhi Abstract As the future of 3G/4G like mobile phones and digital cameras products of light and thin, miniaturization and muti-function change development trend, line level of refinement gradually turned to the microcosmic, microscopic level of micron scale, line also greatly improved the precision requirements. In this article, through the typical third-order three clamp of the production process, from material selection, equipment selection, line resolution, etching uniformity control, uniformity of surface copper control, circuit aspects, etc., it discussed compensation including 50 mm/HDI board including 50 mm fine lines best method of making, production has a certain reference value for fine lines. Key words Fine Lines; Resolution; Copper Etching Uniformity; Surface Uniformity; Dynamic Compensation 1 前言 高端电子产品所必须。因50 mm/50 mm精细线路板制 造过程中集合了特殊铜厚与精细线路的匹配要求， 随着未来手机及数码相机等3G/4G产品的轻、 工艺制作难度高，在压合、减铜、电镀、线路制作 薄、小型化与多功能化发展趋势，对HDI不断提出