SnAgCu焊料中Sn元素在模拟土壤溶液中的浸出行为.pdfVIP

中国环境科学 2012,32(7): 1314-1318 China Environmental Science SnAgCu 焊料中 Sn 元素在模拟土壤溶液中的浸出行为 高艳芳，程从前，王丽华，赵 杰.(大连理工大学材料科学与工程学院，辽宁大连 116085) 捣蛋2 研究了 Sn-3.5Ag-0.75Cu 无铅焊料及其与Cu 基板的侨焊接头在模拟土攘的NaCI，NaCI- 2 4 和NaCI-Na2S0.-Na2COJ 溶液中 Sn Na S0 元素的浸出行为.结果表明:焊料在NaCl-Na2S04-Na2COJ 洛液中Sn 的浸出相对严重;而接头在NaCl 揭穿液中旬的浸出量最多在 Sn 浸出量 多的焊料和接头表面形成厚而疏松的腐蚀产物，XRD分析表明其产物主要由 SnO，SnQz和 SR4(OH) Ch组成动电位极化测试分析表明接头 6 中 Cu 基板与焊料合金之间的电偶腐蚀是焊料合金与接头在同种溶液中 Sn 元素浸出差异的主要原因. 关键词2 无铅焊料g 接头g 浸出行为z 盐挥军液z 腐蚀 中图分~号I X131 文献标识码， A 文章编号， 1 ∞0-6923(2012)07-1314-05 Leaching of Sn frolR SnAgCu solder in silRulated soß solutions. GAO Yan-也ng， CHENG Cong-qian, WANG Li-hua., ZHAO Jie(Sch∞1 of Materials Science and Engin田ring， Dalian University of Technolo町， Dalian 116085, China). China Environmental Science, 2012，32仍: 1314- 1318 Abstract: Leaching behavior of Sn 企om Sn-3 .5Ag-O.75Cu solder alloy and its joints with Cu substrate in three types of simulated soilωlutions， namely NaCI , NaCI-Na2S04 and NaCI-Na2S04-Na2C03 w部 investi伊始d. It was found that serious leaching of Sn in the NaCI-Na2S04-Na2C03 solution was observed for the Sn-3 .5Ag-O.75Cu solder, while for the 缸.-3.5Ag-O.75Cu/Cu joint 由e largest leaching amount of Sn was realized in the NaCI solution. Thick and I∞sen corrosion 伊oducts formed on 伽surface of solder and itsjoints where the leaching had severelyωcurred. From the XRD analysis, it revealed 阳t 由e corrosion 严oduωwere mainly composed of SnO, Sn02 and Sfi4(OH)6Ch. 8ased on the potentiod归wnicpolar国tion plo钮， it was proposed 阳t the galvanic corrosion between solder alloy and Cu substrate was - responsible for the leaching difference between solder and itsjoint. Keywol由: lead-free solder; joint; leaching behavior; .salt solution; ∞πosio