ultrasonic flaw imaging via multipath exploitation通过多路超声波缺陷成像剥削.pdf

Hindawi Publishing Corporation Advances in Acoustics and Vibration Volume 2012, Article ID 874081, 12 pages doi:10.1155/2012/874081 Research Article Ultrasonic Flaw Imaging via Multipath Exploitation Yimin D. Zhang,1 Xizhong Shen,2 Ramazan Demirli,1 and Moeness G. Amin1 1 Center for Advanced Communications, Villanova University, Villanova, PA 19085, USA 2 Electrical and Automatic School, Shanghai Institute of Technology, Shanghai 201418, China Correspondence should be addressed to Ramazan Demirli, ramazan.demirli@ Received 15 December 2011; Accepted 28 April 2012 Academic Editor: Erdal Oruklu Copyright © 2012 Yimin D. Zhang et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. We consider ultrasonic imaging for the visualization of flaws in a material. Ultrasonic imaging is a powerful nondestructive testing (NDT) tool which assesses material conditions via the detection, localization, and classification of flaws inside a structure. We utilize reflections of ultrasonic signals which occur when encountering different media and interior boundaries. These reflections can be cast as direct paths to the target corresponding to the virtual sensors appearing on the top and bottom side of the target. Some of these virtual sensors constitute a virtual aperture, whereas in others, the aperture changes with the transmitter position. Exploitations of multipath extended virtual array apertures provide enhanced imaging capability beyond the limitation of traditional multisensor approaches. The waveforms observed at the physical as well as the virtual sensors yield