symmetric and programmable multi-chip module for low-power prototyping system对称和可编程multi-chip模块低功耗的原型系统.pdfVIP

VLSI DESIGN (C) 2001 OPA (Overseas Publishers Association) N.V. 2001, Vol. 12, No. 2, pp. 113-124 Published by license under Reprints available directly from the publisher the Gordon and Breach Science Photocopying permitted by license only Publishers imprint. Symmetric and Programmable Multi-Chip Module Low-Power Prototyping System MAO-HSU YENa’*, SAO-JIE CHENb and SANKO H. LAN aDepartment ofElectronic Engineering, National Taiwan University of Science and Technology, Taipei, Taiwan, ROC; bDepartment ofElectrical Engineering, National Taiwan University, Taipei, Taiwan, ROC (Received20 June 2000, In final form 3 August 2000) The advantages of a Multi-Chip Module (MCM)product are its low-power and small- size. But the design of an MCM system usually requires weeks ofengineering effort, thus we need a generic MCM substrate with programmable interconnections to accelerate system prototyping. In this paper, we propose a Symmetric and Programmable MCM (SPMCM)substrate for this purpose. This SPMCM substrate consists of a symmetrical array of slots for bare-chip attachment and Field Programmable Interconnect Chips (FPICs) for substrate routing. Experimental results demonstrate that our FPIC poly- gonal routing module uses 12% less switches than the conventional routing module for interconnecting bare-chip slots with 84 pads. Also, experiments are conducted to determina