FINITE ELEMENT ANALYSIS ON THE EFFECT OF （有限元分析的影响）.pdf

Journal of Engineering Science and Technology Vol. 9, No. 1 (2014) 47 - 63 © School of Engineering, Taylor’s University FINITE ELEMENT ANALYSIS ON THE EFFECT OF SOLDER JOINT GEOMETRY FOR THE RELIABILITY OF BALL GRID ARRAY ASSEMBLY WITH FLEXIBLE AND RIGID PCBS CHUN-SEAN LAU*, M. Z. ABDULLAH, M. ABDUL MUJEEBU, N. MD. YUSOP School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia *Corresponding Author: chun_sean@ Abstract In the present study, threedimensional (3D) finite element simulation on 132 PIN fleXBGATM package was performed to predict the effect of solder joint geometry on the reliability of Ball Grid Array (BGA) solder joints on flexible and rigid PCBs subjected to thermocyclic loading. The commercial FEA tool ABAQUS Version 6.9 was used for the simulations of various shapes of solder joints such as barrel, column and hourglass. Apart from a global modeling, the submodeling analysis technique (local modeling) was also used on the critically affected solder joints, in order to enhance the computation efficiency. The accumulated creep strain and stra