Sectional Design Standard for Rigid Organic （截面为刚性有机设计标准）.pdf

ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES IPC-2222 Sectional Design Standard for Rigid Organic Printed Boards ANSI/IPC-2222 February 1998 A standard developed by IPC Supersedes IPC-D-275 2215 Sanders Road, Northbrook, IL 60062-6135 September 1991 Tel. 847.509.9700 Fax 847.509.9798 HIERARCHY OF IPC DESIGN SPECIFICATIONS (2220 SERIES) IPC-2221 GENERIC DESIGN IPC-2222 IPC-2223 IPC-2224 IPC-2225 IPC-2226 IPC-2227 RIGID FLEX PCMCIA MCM-L HDIS DISCRETE WIRE FOREWORD This standard is intended to provide information on the detailed requirements for organic rigid printed board design. All aspects and details of the design requirements are addressed to the extent that they can be applied to the unique require- ments of those designs that use organic rigid (reinforced) materials or organic materials in combination with inorganic mate- rials (metal, glass, ceramic, etc.) to provide the structure for mounting and interconnecting electronic, electromechanical, and mechanical components. The information contained herein is intended to supplement generic engineering considerations and design requirements identified in IPC-2221. When coupled with the engineering design input, the complete disclosure should facilitate the appro- priate sel