Soldering Methods and Procedures for non （非焊接方法和程序）.pdf

Application Note seen that the solder covers a good deal of the surface area Soldering Methods and Procedures for of both the pin and the pad. This is also evidence of good wetting. Notice also that the solder joint has a smooth 1st and 2nd Generation Power Modules surface with a silver color. This is evidence of good immobilization of the joint during cooling as well as good cleaning of the board prior to soldering. All soldering Overview connections should exhibit similar characteristics regardless of whether they are soldered by hand or wave This document is intended to provide guidance in utilizing soldered. soldering practices to make high quality connections of Vicor Power Modules to printed circuit boards. Some care will be taken to outline appropriate soldering procedures as well as the evaluation of solder joints in a manner that enables the customer to insure that the end application has an optimal connection to the power module. Common soldering defects will be examined and direction will be provided for detecting and handling the common defects. Vicor’s manufacturing facilities use the IPC-A-610C standards as a means of establishing quality solder joints. It is recommended that manufacturing processes using Vicor modules refer to these same standards which can be fou